JPH0292945U - - Google Patents
Info
- Publication number
- JPH0292945U JPH0292945U JP127989U JP127989U JPH0292945U JP H0292945 U JPH0292945 U JP H0292945U JP 127989 U JP127989 U JP 127989U JP 127989 U JP127989 U JP 127989U JP H0292945 U JPH0292945 U JP H0292945U
- Authority
- JP
- Japan
- Prior art keywords
- lead pin
- recess
- mold
- lead
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP127989U JPH0292945U (en]) | 1989-01-10 | 1989-01-10 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP127989U JPH0292945U (en]) | 1989-01-10 | 1989-01-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0292945U true JPH0292945U (en]) | 1990-07-24 |
Family
ID=31201036
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP127989U Pending JPH0292945U (en]) | 1989-01-10 | 1989-01-10 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0292945U (en]) |
-
1989
- 1989-01-10 JP JP127989U patent/JPH0292945U/ja active Pending